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This packaging
is mainly used for the transportation
of miniaturised IC and
connectors and are produced from extruded
sheets as well. The
process
involves feeding the extruded sheet
into the thermoforming
machine. The
extruded sheet is then
heated and
the required
pocket shape
and dimensions are formed on the heated
sheet by imprinting the
forming die onto the sheet
in a continuous process. Holes are punched
onto the edges
of the formed tape. The end product
is then rolled into reeels and packed
for shipment to our customers.
Thermoforming process of carrier tape
for semiconductor, connectors and
other related industries.
• EIA and JIS standards
• Tool Build Capability
• Cover Tapes (HA & PSA)
• Plastic Reels |
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